Topical Symposium 3
The emerging energy-efficient and smart technologies, like those enabling the Internet of Things (IoT), are demanding facile, large area, low cost, scalable, and environmentally friendly processes. A fundamental platform for their realization is undisputedly flexible thin film technology. This Topical Symposium will focus on developments in thin film processes compatible with flexible substrates that will include, but are not limited to: vacuum technology on flexible substrates (e.g. polymer, paper, thin glass, etc.), large area manufacturing (e.g. r-2-r, c-2-c, batch reactors, etc.), ink technology (for slot die, inkjet, gravure, flexo, etc.), photonic processes (photonically assisted deposition and/or post-deposition photonic processing) and others. Additionally, advances in testing and characterization specific to flexible thin films will be considered (e.g. in-line optical characterization, off-line mechanical testing, etc.). Potential applications are envisioned in the sectors of packaging, electronics, sensors, energy storage and/or generation, solid-state lighting, displays, functional coatings, protective coatings, and beyond.
TS3. Invited Speakers:
- Thomas D Anthopoulos, King Abdulah University of Science and Technology (KAUST), KSA, Saudi Arabia, “Upscalable Nanomanufacturing of Thin-Film Electronics”
- Ravi P Silva, University of Surrey, UK, “Towards Large Area Scalable Organic Solar Cells using Solution Processing”